硅片是非常硬质的材料，高密度的硅片需要通过专业设备切割后才能正常使用，切割硅片需要使用金刚拉丝的金刚切割机。大体量的设备不仅要使用水，而且要使用金钢丝作为切割的工具。从外观到结构的设计有许多要求和限制，比如说设备上料及操作的便利性，整机外围的防水都有较高的要求。

HURAKAN从产品外观设计将其与传统铣削机床设备做了区分，产品配色及外部标识与传统大型机床设备也做了区分；结构设计师仔细分析了每个操作区域的结构方式，保证了产品加工状态可观察，上料方便及整机外围的密封性。

Silicon wafer is a very hard material, high density silicon wafer needs to be cut through professional equipment before normal use, cutting silicon wafer need to use diamond wire diamond cutting machine. Large volumes of equipment should use not only water but also gold wire as a cutting tool. From the appearance to the design of the structure there are many requirements and restrictions, such as the equipment on the material and the convenience of operation, the outer waterproof machine have higher requirements.

HURAKAN distinguishes itself from traditional milling machine tools and equipment in terms of product appearance design, and also distinguishes itself from traditional large-scale machine tools and equipment in terms of product color matching and external identification. The structural designer carefully analyzed the structural mode of each operation area to ensure that the product processing state can be observed, feeding is convenient and the sealing of the periphery of the machine.