HURAKAN深耕半导体高端设备工业设计领域，全程主导本次固态湿法半导体设备的整机设计与量产落地工作。项目前期深度对标半导体湿法工艺生产标准，结合设备腐蚀、清洗、镀膜等核心工况，联动客户研发、工艺、量产团队完成全维度需求摸排，针对设备防腐防尘、密闭制程、管路排布、重型机身装配等核心难点，反复校核整机尺寸公差、模组适配性与无尘车间适配规范，多轮迭代优化设计方案，全程跟进样机试制、试产调试与开模落地环节，彻底规避行业设备常见的结构干涉、维护不便、工况适配性差等量产问题，以全流程、高标准的落地实操能力，保障设计方案1:1精准落地量产。

HURAKAN took charge of the whole-machine design and mass production implementation of the solid-state wet semiconductor equipment. In the early stage, we deeply benchmarked the production standards of semiconductor wet processes, conducted comprehensive demand research with the client’s R&D, process and mass production teams focusing on core working conditions such as equipment corrosion, cleaning and coating. We repeatedly verified the overall dimensional tolerance, module compatibility and clean workshop adaptation specifications, iterated and optimized the design scheme for multiple rounds, and followed up prototype trial production, commissioning and mold opening throughout the process. It avoids common mass production problems such as structural interference, inconvenient maintenance and poor working condition adaptability of industrial equipment, ensuring the accurate mass production of design schemes with full-process and high-standard implementation capabilities.

针对传统固态湿法设备造型笨重、结构杂乱、操作繁琐的行业痛点，HURAKAN完成全方位创新升级。造型层面摒弃传统工业设备硬朗呆板的堆砌式外观，结合无尘车间极简整洁的空间调性，打造一体化流线型整机造型，优化机身比例与视觉层次，兼顾设备专业性与精致质感；结构层面采用模块化分体式架构，将制程腔体、管路系统、电控模组分区集成，实现独立拆装、分区维保，大幅降低设备检修、耗材更换难度，同时强化机身密封防腐结构设计，适配湿法特殊工艺环境；人机交互层面贴合车间操作人员作业流程，优化触控屏幕尺寸、操作高度与功能分区，简化湿法工艺参数调试、设备启停、故障排查操作逻辑，适配长时间连续作业场景，大幅提升设备操作效率与使用安全性。

Aiming at the industry pain points of traditional solid-state wet equipment such as bulky shape, disordered structure and cumbersome operation, HURAKAN achieved all-round innovative upgrading. In terms of shape, we abandon the rigid and stacked appearance of traditional industrial equipment, create an integrated streamlined overall shape combining the minimalist and tidy spatial tone of clean workshops, and optimize the fuselage proportion and visual hierarchy to balance professionalism and exquisite texture. In terms of structure, a modular split architecture is adopted to integrate the process cavity, pipeline system and electronic control modules in zones, realizing independent disassembly and zoned maintenance, which greatly reduces the difficulty of equipment maintenance and consumable replacement. Meanwhile, the optimized sealing and anti-corrosion structure adapts to the special wet process environment. In terms of human-computer interaction, we optimize the touch screen size, operation height and functional zoning according to the workshop operation process, simplify the operation logic of wet process parameter debugging, equipment start-stop and fault troubleshooting, and adapt to long-term continuous operation scenarios to improve operational efficiency and safety.

本次差异化创新设计彻底打破了固态湿法半导体设备行业同质化严重、外观老旧、体验滞后的市场僵局，让设备摆脱了纯工具化的低端产品标签。整机极简高端的视觉形态、规整有序的结构布局与人性化的操作体验，成为产品核心差异化卖点，有效区别于市面同类竞品，帮助客户重塑产品高端专业的市场形象，突破行业低价内卷的竞争格局，为产品实现精准市场溢价奠定坚实基础。

This differentiated innovative design completely breaks the market deadlock of serious homogenization, outdated appearance and lagging experience in the solid-state wet semiconductor equipment industry, freeing the equipment from the low-end product label of pure tooling. The minimalist and high-end visual form, standardized and orderly structural layout and humanized operation experience become the core differentiated selling points of the product, effectively distinguishing it from similar products on the market. It helps clients reshape the high-end and professional market image of products, break the low-price involution competition pattern in the industry, and lay a solid foundation for accurate market premium of products.

设备量产上市后，凭借出众的外观质感、稳定的结构性能与高效的操作体验，快速获得晶圆制造、半导体封装测试等上下游企业的高度认可，顺利切入中高端半导体湿法设备采购供应链。相较于客户上一代产品，新品市场询价率、意向签约量大幅提升，有效拉动整体产品销量增长，同时依托高端产品定位，显著提升了品牌在精密半导体工艺设备领域的市场占有率与行业话语权。

After mass production and launch, the equipment has quickly gained high recognition from upstream and downstream enterprises such as wafer manufacturing and semiconductor packaging and testing, relying on its outstanding appearance texture, stable structural performance and efficient operation experience, and successfully entered the mid-to-high-end semiconductor wet equipment procurement supply chain. Compared with the client’s previous generation products, the new product has a greatly increased market inquiry rate and intentional signing volume, effectively driving the overall product sales growth. Meanwhile, relying on the high-end product positioning, it has significantly improved the brand’s market share and industry discourse power in the field of precision semiconductor process equipment.

HURAKAN始终以「落地为核心、创新为赋能」的设计逻辑，深耕半导体精密设备赛道，兼顾工艺落地性、产品创新性与商业价值性，为工业设备客户打造兼具颜值、性能与市场竞争力的量产级设计方案，持续助力客户夯实品牌壁垒、提升产品溢价能力，实现长效可持续的商业增长。

Adhering to the design logic of "implementation as the core and innovation as empowerment", HURAKAN deeply cultivates the track of semiconductor precision equipment, balancing process implementation, product innovation and commercial value. We create mass-production-level design solutions with appearance, performance and market competitiveness for industrial equipment clients, continuously helping them consolidate brand barriers, improve product premium capability and achieve long-term and sustainable commercial growth.